Advanced Micro Devices' chiplet architecture in CPUs and GPUs positions it to outperform Nvidia in the inference market. See ...

Intel Nova Lake CPUs aren’t coming for over a year and a half, so we won’t have all the details for some time. As Panther Lake starts to take shape, though, it’ll give us more of an idea of what to ...

Summary Fraunhofer’s “White House of Microelectronics Packaging” in Dresden has led 3D integration research for 15 years. It pioneered Cu TSV, wafer-level packaging, and AI-driven chiplet technology.

AMD’s MI400 APU lands in 2026, boosting AI, HPC, and compute efficiency New design features two AIDs with eight XCDs, ...

An intriguing addition to the MI400 is the Multimedia IO Die (MID), which separates the multimedia engine from the AIDs. The ...

AMD's next-gen Zen 6 desktop CPUs codenamed Medusa Point rumored to bump up the core count: 24 cores, 48 threads coming with ...

AMD's 16-core Ryzen 9 9950X3D and 12-core Ryzen 9 9900X3D may cost $699 and $599, respectively, per data from early listings ...

Summary Deploying AI at scale demands massive computing power and high-speed networking, but connectivity bottlenecks slow progress. AI data centers rely on dedicated infrastructure, high-bandwidth ...

Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...

As of September 2024, AMD had $4.5 billion in cash and cash equivalents against total debt of $1.7 billion. AMD took on debt to acquire Xilinx, but Xilinx generates healthy cash flow, and now that AMD ...

Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...