A new technical paper titled “SRAM and Mixed-Signal Logic With Noise Immunity in 3nm Nano-Sheet Technology” was published by ...

Subthreshold Analog AI Accelerator Based on Stochastic Gradient Descent” was published by researchers at Imperial College London. Abstract “The rapid proliferation of AI models, coupled with growing ...

Trump's tech stamp; Chiplet Summit announcements; AI diffusion export concerns; Cadence's security acquisition; chiplets; UMC ...

Reverse Engineering Approach for Evaluating Hardware IP Protection” was published by researchers at University of Florida and Indiana University. Abstract “Existing countermeasures for hardware IP ...

Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties ...

Semiconductor Engineering sat down with Dan Brewer and Srikanth Kommu, co-CEOs at Brewer Science, to talk about current and future changes in materials used in semiconductor manufacturing and adjacent ...

Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...

This enables the EUV lithography era of today, which is likely to continue for the foreseeable future. Initially, EUV became ...

Accelerate tool development and reduce the consumption of physical resources like silicon wafers, chemicals, and gases.

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

The MEMS & Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor ...