ACM Research has announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool. The resulting ...

Sk hynix claims SK hynix has announced plans to add an additional four layers to its 12-HI HBM3e memory chips in a drive to ...

The semiconductor industry faces a transformative moment as TSMC readies its Arizona fab's politically-charged December ...

Samsung’s current 286-layer V9 NAND chips marked a significant milestone, but the 400-layer V10 is expected to redefine ...

New non-volatile memory report projects that baseline industry revenues could rise to 71.7B by 2034 and displace SRAM, NOR ...

I had a fascinating talk with Arm Senior VP Chris Bergey on the power of AI and the future of on-device processing ...

Nvidia has asked SK hynix to move up its delivery timeline for next-generation HBM4 memory chips by six months, according to ...

Summary SK hynix CEO Kwak Noh-jung announced plans to launch the industry's first 48GB, 16-layer high-bandwidth memory (HBM) chips early next year, enhancing AI chip performance. The new HBM3E chips, ...

Researchers from the University of Pittsburgh, University of California Santa Barbara, University of Cagliari, and Institute ...

Acer has just teased its new CUDIMM memory modules, with the introduction of its new CUDIMM memory module design called Hera ...

Semiconductors are used primarily in memory devices ... often combining many layers of multiple materials, circuitry or ...

Nvidia is urging SK Hynix to fast-track the production of its high-bandwidth memory (HBM4) chips as demand for AI hardware ...