The 16-Layer HBM3e chips are expected to roll-out in 2025 New chips offer improved AI learning and inference capabilities ...

High-Bandwidth Memory 5 is intended to further increase the number of memory layers. This requires modern stacking technology ...

Nvidia CEO Jensen Huang had asked memory chip maker SK Hynix to bring forward by six months the supply of its next-generation ...

Samsung to release 400-layer NAND chip for AI data centers New BV NAND tech boosts density and minimizes heat buildup Plans ...

SK Group Chair Chey Tae-won said Nvidia CEO Jensen Huang asked him if SK Hynix could move the supply of high-bandwith memory ...

Under a memorandum of understanding with the provincial government, Samsung Electronics will convert an underused liquid ...

Samsung declared progress in supplying AI memory chips to Nvidia Corp., seeking to reassure to investors who fear the company ...

2024 that it would produce the world's first 16-layer HBM3E chips and provide them in early 2025. The world's second-largest ...

Nvidia Corp CEO Jensen Huang has requested SK Hynix Inc. to expedite the supply of its next-generation high-bandwidth memory ...

The head of AI computing giant Nvidia asked South Korea's SK hynix to speed up delivery of newer, more advanced HBM4 chips by six months, the head of SK Group said Monday.

An Nvidia (NVDA) partner in South Korea saw its shares surge Monday after it said the U.S.-based chipmaker wants chips faster ...