This is why the U.S. is looking to bolster its capabilities. Today, U.S.-based OSATs are capable of providing various technologies, such as wirebond, flip-chip and advanced packaging. They just need ...

A chip packaging technique in which the active area ... any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel ...

Although named after the semiconductor packaging technique we are familiar with today, DEC Flip-Chips were introduced in 1964 as a modular electronics packaging system. These were used in many of ...

Chip packaging further adds to the design challenge. More than ever, chip designers are creating designs using flip chip packaging, which increases the complexity of the I/O integration into the ...

Nature Research Intelligence Topics enable transformational understanding and discovery in research by categorising any document into meaningful, accessible topics. Read this blog to understand ...

Semiconductor packaging underfill reduces the impact of the global thermal expansion mismatch between the substrate and silicon chip. Surfaces beneath flip chips, chip-scale packages, and ball ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

the Samsung Galaxy Z Flip FE will not use the 3nm Exynos 2500 but the 4nm Exynos 2400e. The latter, produced using the IPoP packaging technique, is present in the Galaxy S24 FE. This chip is ...