The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...

To maximize performance, Broadcom suggests disintegrating the design of compute chiplets and stacking one logic chiplet on top of another in a face-to-face (F2F) manner using hybrid copper bonding ...

But a few weeks ago, Cadence took things a significant step further, and actually architected, designed, and taped out what the company calls the industry’s first Arm-based system chiplet ...

Broadcom (NASDAQ: AVGO) had an incredible 2024, with the stock more than doubling. After a run-up like that, many investors might wonder how much upside potential is left -- if any. Broadcom is in ...

Broadcom's full-year results were also impressive. Revenue grew 44% to a record $51.6 billion, and the company reached $12.2 billion in AI revenue, an increase of 220% from 2023. Broadcom's ...