Broadcom's 3.5D XDSiP uses TSMC's CoWoS-L packaging technology that offers a maximum interposer size of approximately ... for design teams to disaggregate ASIC architecture between top and bottom ...

They also grant CSPs greater control over their technical stack. Within the ASIC market, Broadcom and Marvell stand out as key competitors, each employing distinct technologies and strategic ...

A key factor that will work in Broadcom's favor is its strong share of the ASIC market ... to $45 billion (based on the company's estimated size of the custom AI chip market).

2025 /EINPresswire / -- The latest report published by Coherent market Insights highlights the growth prospects of the ASIC Chip Market from 2025 to 2032. In-depth research on industry Size ...

Broadcom CEO Hock Tan, in fact, told investors on a conference call late Thursday that the group's potential market for both its networking and ASIC offerings could rise to $90 billion over the ...